Dhs Cyber Incident Response Teams Act of 2019
Floor Speech
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Mr. SOTO. Madam Speaker, I would like to acknowledge that Division A of H.R. 1158, Consolidated Appropriations Act, 2020's Joint Explanatory Statement to Division A, provided an increase to the Industrial Base Analysis and Sustainment Support program within the Research, Development, Test and Evaluation, Defense-Wide account. Specifically, a general program increase of $10,000,000, a $12,500,000 program increase for manufacturing engineering, a $20,000,000 program increase for machine and advanced manufacturing, and a $5,000,000 program increase for an interdisciplinary center for advanced manufacturing systems. These funds will allow the Department of Defense to leverage existing public-private-partnerships to establish a U.S. based manufacturing development platform for advanced microelectronic system integration, including anti-tamper heterogeneous integration and foundational copper-based silicon interposer technology.
The Industrial Base Analysis and Sustainment program is dedicated to ensuring that the Department of Defense is positioned to more effectively, and efficiently, address industrial base issues, and support the National Security Innovation Base. This includes the ability to proactively mitigate supply chain vulnerabilities within the global defense industrial base, and to cultivate next generation, emerging, defense manufacturing and technology sectors.
Continued U.S. global leadership in microelectronics depends on U.S. owned firms operating at the leading edge of advanced logic technologies and digital memories. The next generation of electronic devices will require significantly greater functional density, in other words, packing functional components together even more tightly than current technology allows. This requires technical leadership in microelectronics system integration, specifically in the microelectronics manufacturing areas of integrating heterogeneous devices, stacking memory, logic processing, sensors, communications, and packaging with security and advanced interconnect methods.
One of the foundational technologies required for advanced system integration is copper-based silicon interposer technology. This foundational interposer technology can enable almost any microelectronic dependent, or internet of things, system. However, advanced system integration capabilities have moved offshore due to cost, and there currently is no domestic sources that can reliably serve the low volumes of advanced microelectronics that the Department of Defense requires.
That is why there is a need for the Industrial Base Analysis and Sustainment Support Program to leverage existing public-private- partnerships to establish a U.S. based manufacturing development platform for advanced microelectronic system integration, including the foundational copperbased silicon interposer technology. This funding increase will help to accomplish this, and I thank the Chairwoman for the overall funding increases for the Industrial Base Analysis and Sustainment Support Program within the Research, Development, Test and Evaluation, Defense-Wide Account.
I want to express my gratitude and thank Chairwoman Lowey, Chairman Visclosky, and the full Committee for all their work on the issue.
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Mr. SOTO. Madam Speaker, I would like to acknowledge that Division A of H.R. 1158, Consolidated Appropriations Act, 2020's Joint Explanatory Statement to Division A, provided an increase to the Trusted and Assured Microelectronics program within the Research, Development, Test and Evaluation, Defense-Wide account. These funds will allow the Department of Defense to leverage existing public-private-partnerships to enable a U.S. based manufacturing development platform for advanced microelectronic system integration, including anti-tamper heterogeneous integration and foundational copper-based silicon interposer technology.
I want to express my gratitude to Chairwoman Lowey, Chairman Visclosky, and the full Committee for the inclusion of this funding increase and for recognizing the urgent need to invest in trusted foundries, advanced microelectronics cybersecurity, and manufacturing capabilities that will translate our domestic research into fielded capabilities for the warfighter.
Ensuring quick, reliable, and secure access to leading-edge microelectronics is often a challenge. The changing global semiconductor industry and the increasing sophistication of U.S. adversaries require us to update our domestic microelectronics security framework.
Continued U.S. global leadership in microelectronics depends on U.S. owned firms operating at the leading edge of advanced logic technologies and digital memories. The next generation of electronic devices will require significantly greater functional density, in other words, packing functional components together even more tightly than current technology allows. This requires technical leadership in microelectronics system integration, specifically in the microelectronics manufacturing areas of integrating heterogeneous devices, stacking memory, logic processing, sensors, communications, and packaging with security and advanced interconnect methods.
One of the foundational technologies required for advanced system integration is copper-based silicon interposer technology--also known as heterogeneous integration. This foundational interposer technology can enable almost any microelectronic dependent, or internet of things, system. However, advanced system integration capabilities have moved offshore due to cost, and there currently is no domestic sources that can reliably serve the low volumes of advanced microelectronics that the Department of Defense requires. That's why this funding is so critical. We must invest in these advanced integrated capabilities so we can secure our microelectronic systems that our service members depend on.
Again, I support disruptive science and technology that enables a rapid modernization of our trusted and assured microelectronics systems. I thank my colleagues for their shared support.
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Mr. SOTO. Madam Speaker, I would like to acknowledge that Division A of H.R. 1158, Consolidated Appropriations Act, 2020's Joint Explanatory Statement to Division A, provided an increase to the Defense-Wide Manufacturing Science and Technology Program within the Research, Development, Test and Evaluation, Defense-Wide account. Specifically, a general program increase of $20,000,000, a $5,000,000 program increase for manufacturing engineering programs, a $10,000,000 program increase for manufacturing innovation institutes, a $10,000,000 program increase for advanced manufacturing, and a $14,000,000 program increase for manufacturing cybersecurity.
I want to express my gratitude to Chairwoman Lowey, Chairman Visclosky, and the full Committee for the inclusion of joint explanatory language to the bill noting the importance of obtaining advanced microelectronics manufacturing, in support of the defense industrial base, from trusted domestic suppliers.
Ensuring quick, reliable, and secure access to leading-edge microelectronics is often a challenge. The changing global semiconductor industry and the increasing sophistication of U.S. adversaries require us to update our domestic microelectronics security framework by establishing a comprehensive, public-private partnership- structured microelectronics cybersecurity center.
This center can provide the defense industrial base with access to manufacturing resources to support antitamper, devices, hardware security, and other evolving new concept technologies that support trusted and assured manufacturing, combined with advanced system integration and packaging technologies--known as heterogeneous integration.
The Defense-Wide Manufacturing Science and Technology Program enables the Department of Defense to advance reliable and secure state-of-the- art technologies. The funding increase provided in this legislation, along with the increased funding for advanced manufacturing, will facilitate America's innovative, secure, and domestic foundry operations and greatly contribute to our national defense through the establishment of a microelectronics cybersecurity center structured as a public-private partnership.
Again, I thank the Committee for recognizing the urgent need to invest in trusted foundries, advanced microelectronics cybersecurity, and manufacturing capabilities that will translate our domestic research into fielded capabilities for the warfighter. I would like to thank Chairwoman Lowey, Chairman Visclosky, and the full Committee for all their work on the issue.
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Mr. SOTO. Madam Speaker, I would like to acknowledge that Division A of H.R. 1158, Consolidated Appropriations Act, 2020's Joint Explanatory Statement to Division A, provided an increase to the Soldier Lethality Technology Program within the Research, Development, Test and Evaluation, Army account. Specifically, a general program increase of $5,000,000.
I want to express my gratitude to Chairwoman Lowey, Chairman Visclosky, and the full Committee for the inclusion of this funding increase. These funds allow the Army Research Lab to conduct work on a number of important disruptive science and technology programs, including millimeter-wave imager sensor technology needed to improve situational awareness to our service men and women.
Ensuring access to low cost imager sensors to provide leap-ahead capability in urban combat and situational awareness will enable troops to move, communicate, protect, and sustain themselves better in any combat environment. Such sensors can be used in a reconnaissance role, with the ability to see inhabitants within building structures and provide significant situational insight within dense urban environments.
Again, I support the modernization of the U.S. Army and to support disruptive science and technology. I thank my colleagues for their shared support.
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