Schumer Launches Push To Secure Fed Funding For Binghaton University To Develop Cutting-Edge High-Tech Electronics -- Funding Would Enable BU To Create 50-200 Jobs By Developing Next Generation Of Advanced Electronic Products At It's CEnter For Advanced Microelectronics Manufacturing

Press Release

U.S. Senator Charles E. Schumer today announced his push to secure federal funds for Binghamton University to develop high-tech electronics and create local jobs. Schumer explained that FlexTech Alliance, a California based consortium of industry leaders in electronics manufacturing, is currently working with Binghamton University and a consortium of universities and companies across the country, to apply through the Department of Defense (DOD) to become a Flexible Hybrid Electronics Manufacturing Innovation Institute. Receiving this designation would award them a total of $100 million in federal funding to develop flexible hybrid electronics, a sophisticated technology found in advanced robotics, computers, biomedical and sensory devices, for manufacturing and production.

With Binghamton University (BU) leading the New York node of the application, the University and its local partners across New York State could stand to receive $20 million to work on the research and development portion of this project if the application is selected. Schumer said this award could bring 50 local jobs within the first two years, with the potential to create a total of 200 new jobs. Schumer explained the ripple effect of this award could mean 500 to 1,000 jobs for New York State over the next 7-10 years, as companies like i3 Electronics could win contracts to develop this technology, while others corporate partners like Lockheed Martin, BAE, Corning, Inc. and GE could win contracts to manufacture these technologies for both commercial and government use.

"Securing this institute designation and funding has the potential to put Binghamton University and its local partners across New York State on the map as leaders in the high-tech electronics industry. This would be a major win for the Southern Tier, which would serve as the project's hub for research and development and create good-paying jobs for potentially hundreds of people," said Schumer. "BU has assembled a top-notch team of corporate and academic partners in their application, and I have seen firsthand that they are prepared to get the job done and develop the next generation of advanced electronics. That is why I will be fighting vigorously on behalf of this application."

Schumer explained that if FlexTech is given the award, BU's research and development for these high-tech electronics products would be housed in its Center for Advanced Microelectronics Manufacturing (CAMM) played a leading role in securing the federal financial assistance that facilitated CAMM's establishment. Schumer explained that FlexTech's application involves numerous research institutions and corporations across several states, including New York. Schumer said BU has worked extensively with its corporate partners to develop technology for their industries such as electronic packaging and reliability, thin chip-on-flex electronic systems-in-package technology, and 2.5D electronic imposers. Given its history in the high-tech manufacturing industry, BU and CAMM would be a perfect fit for the MII.

Schumer said BU has sought out New York-based corporate research partners to assist its push to become a manufacturing innovation institute, such as General Electronic Global Resarch, Corning, Inc., and i3 Electronics, Inc. Schumer said if FlexTech's application is approved, $20 million will go directly to BU and CAMM to work on research and development for the project. This will pave the way for the creation of 50 to 200 jobs over the next two plus years. Schumer said other companies such as Lockheed Martin, BAE, Corning and GE could win system level contracts to integrate this hybrid technology for commercial and government use as well, which would have the potential to bring an additional 500 to 1,000 jobs to Upstate New York over the next 7-10 years.

The Manufacturing Innovation Institute initiative was launched by the White House and Department of Defense (DOD) to find opportunities to bring research institutions together with private companies to advance specific technological sectors. One of those sectors was flexible hybrid electronics (FHE), which combines advanced materials that flex with thinned silicon chips to produce sophisticated electronic products found in robotics, vehicles, infrastructure, and military equipment.

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